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Overview of Common Defects in PTH Plated Through - Hole Cross - Sections

2025-11-17

PTH Plated Through.png

The following lists various defects of PTH plated through - hole cross - sections, covering 42 types of defects from resin blistering, laminate void to glass fiber protrusion, foreign inclusion, etc. Meanwhile, process issues such as undercut, outgrowth, and overhang are marked. It provides an intuitive and comprehensive reference for the PCB (Printed Circuit Board) industry to analyze the quality defects of PTH plated through - holes and optimize the production process.

  1. Resin Blistering 
  2. Laminate Void 
  3. Delamination 
  4. Lifted Land 
  5. Pad lifting 
  6. Burr 
  7. Pink Ring 
  8. Etchback 
  9. Foil Crack
  10. Void(PTH)
  11. Wedge Void 
  12. Glass Void 
  13. MICrovoid 
  14. Arrow Heading 
  15. Nail Heading 
  16. Drilling Cracks 
  17. Innerlayer Burning(ICD ) （ICD=Interconnection Defect）
  18. Pull Away 
  19. Corner Crack 
  20. Blistering 
  1. Glass Fiber Protrusion
  2. D - Effect
  3. Wicking 
  4. Void (Metal Resist) 
  5. Etchback (Positive)
  6. Barrel Crack 
  7. Shadowing 
  8. Nodule 
  9. Rest Smear (ICD) 
  10. Void (Resist Residues) 
  11. Burned Plating
  12. Starburst 
  13. Red Resin 
  14. Resin Crack 
  15. Crazing 
  16. Foreign Inclusion 
  17. Prepreg Void 
  18. Pocket Void 
  19. Measling
  20. Resin Recession 
  21. Weave Texture 
  22. Glass - Weave - Texture 
  • A Undercut 
  • B Outgrowth 
  • C Overhang 
In the printed circuit board (PCB) manufacturing process, PTH (Plated Through Hole) is a core link for realizing the interconnection of multi - layer circuits, and its quality directly affects the electrical peRFormance and reliability of the circuit board. The diagram "Overview of Common Defects in PTH Plated Through - Hole Cross - Sections" systematically presents various defects in this link, providing an intuitive guide for industry analysis and process optimization.
In terms of defect types, this diagram covers 42 typical problems, which can be roughly divided into material defects (such as resin blistering, laminate void, and glass yarn bundle cracking), process defects (such as undercut, outgrowth, and overhang), plating and etching defects (such as burned plating, etchback, and positive etchback), and hole wall defects (such as void, barrel crack, and rest smear). For example, "resin blistering" is caused by the deformation and cracking of resin after being heated or stressed, and "glass fiber protrusion" is the manifestation that glass fiber is not completely covered in the manufacturing process; process problems such as undercut and outgrowth reflect the precision deviation in the drilling and etching links.
The existence of these defects will have multi - dimensional impacts on PCBs: in terms of electrical performance, void and barrel crack can lead to open circuits, and wicking may cause short circuits; in terms of mechanical performance, delamination and foil crack will weaken the strength of the hole wall and reduce the bending resistance of the circuit board; in terms of long - term reliability, defects such as foreign inclusion and nodule are likely to become the starting point of corrosion and accelerate the aging of the circuit board.
For the PCB industry, the value of this defect overview is self - evident. It provides a "defect dictionary" for quality inspectors, facilitating quick problem identification; it provides a target for process engineers to optimize the manufacturing process —— for resin blistering, material selection and curing process can be optimized, and for undercut, etching parameters and mask precision can be adjusted; it also helps the industry establish a standardized defect analysis system, promoting the quality upgrade of the PTH process and even the entire PCB manufacturing process.