contact us
Leave Your Message

Quality Acceptance Standards for Gold Finger Chamfering Process

2025-06-16

Gold Finger.jpeg

1. BasIC Chamfer Parameters

Item Requirement Inspection Method
Chamfer Angle 30° or 45° (±2° tolerance) Projector/Optical Profilometer
Chamfer Length 0.2–0.5mm (±0.1mm tolerance) Micrometer/Laser Scan
Symmetry Bilateral length difference ≤0.05mm CMM (Coordinate Measuring Machine)

2. Cosmetic Defect Control

  • Plating Integrity:

    • No copper exposure or gold peeling (Au thickness ≥0.8μm, Ni underlayer 3–5μm).

    • SCRatch depth ≤5μm (no visible cracks under 100× microscope).

  • Edge Quality:

    • Burr-free and chipping-free (smooth touch, fiber residue width <20μm).

    • Smooth transition between chamfer and PCB suRFace (R-angle ≤0.1mm).

3. Dimensional & Geometric Tolerances

Key Item Tolerance Tool
Position Accuracy ±0.15mm (relative to board edge) 2D Image Measurer
Edge Perpendicularity ≤0.1mm/100mm length Square Gauge + Feeler Gauge
Coplanarity Height variation ≤0.1mm across all fingers Flatness Tester

4. Functional Validation

  • Insertion Durability:

    • After 500 mating cycles, plating wear area <5%, contact resistance change ≤10%.

  • Environmental Reliability:

    • No plating cracks/delamination after thermal cycling (-40°C~+125°C, 100 cycles).

    • Edge corrosion depth ≤3μm after salt spray test (96hrs, 5% NaCl).

5. Process Defect Criteria

Defect Type Acceptance Criteria Rejection Criteria
Angle Deviation ≤±2° ＞±3° or functional impairment
Plating Voids Single void ≤0.1mm, ≤2 voids total Exposed base material or continuous voids
Mechanical Damage Chip depth ≤0.05mm Causing impedance shift or short circuit