ROGERS Data sheet

Rogers RO4003C and RO4350B Laminates: Excellent Choice for High-Frequency Circuit Materials
With the rapid development of electronic technology, high-frequency circuits are increasingly widely used in fields such as communications and wireless devices, and the performance requirements for circuit materials are becoming increasingly strict. The RO4003C™ and RO4350B™ laminates launched by Rogers Corporation have become star products in the field of high-frequency circuit materials due to their excellent performance.
1. Core Advantages of the Products
RO4003C and RO4350B laminates belong to Rogers' RO4000™ series of high-frequency circuit materials. They are glass-reinforced hydrocarbon and ceramic (non-PTFE) laminates designed for performance-sensitive, high-volume commercial applications.
- Excellent high-frequency performance: These two laminates are designed to provide ultra-high-frequency performance and low-cost circuit manufacturing capabilities. They are low-loss materials and can be manufactured using standard epoxy/glass (FR-4) processes, which greatly reduces signal attenuation during high-frequency signal transmission, ensures signal integrity, and lays the foundation for the efficient operation of high-frequency circuits.
- Unique resistor foil technology: Equipped with TICER™ TCR® thin film resistor foils, it brings the advantage of integrated thin and stable resistors to the circuit, further improving the stability and reliability of the circuit in terms of resistance performance.
- Other excellent characteristics: Using glass-reinforced hydrocarbon and ceramic dielectrics, it has excellent high-frequency performance; suitable for batch manufacturing processes, able to meet the needs of large-scale production; low Z-axis expansion, with excellent dimensional stability, ensuring that the physical structure and electrical performance of the circuit remain stable under different environmental conditions; and has CA (a certain chemical substance) resistance, enhancing the durability of the material in specific chemical environments.
2. Analysis of Performance Parameters
From the performance parameter table, the two products perform well in key indicators such as dielectric constant, loss factor, and copper peel strength.
- Dielectric constant: The process specification dielectric constant (Z direction, 10GHz/23℃) of RO4003C is 3.38±0.05, and the design specification dielectric constant is 3.55; the process specification dielectric constant (Z direction, 10GHz/23℃) of RO4350B is 3.48±0.05, and the design specification dielectric constant is 3.66. The dielectric constant is an important indicator to measure the ability of a dielectric to store electrical energy, and a suitable dielectric constant helps the transmission and processing of high-frequency signals.
- Loss factor: The loss factor of RO4003C at 10GHz/23℃ is 0.0027 (typical value) and 0.0031 (maximum value); that of RO4350B is 0.0037 (typical value) and 0.0031 (maximum value). The lower the loss factor, the smaller the energy loss of the material at high frequencies, and the better the signal strength can be maintained.
- Copper peel strength: The copper peel strength of RO4350B after solder float (260℃, 10 seconds) is 0.70N/mm, showing good copper foil adhesion ability, ensuring the mechanical stability and electrical connection reliability of the circuit.
3. Typical Application Scenarios
With their excellent performance, these two laminates are widely used in many fields.
- Global communication systems: In global communication systems, a large number of high-frequency signals need to be processed. RO4003C and RO4350B can ensure efficient transmission and low loss of signals, helping communication systems achieve stable and high-speed information interaction.
- High-reliability and complex multi-layer circuits: For complex multi-layer circuits with high reliability requirements, such as circuits in the aerospace and medical equipment fields, the dimensional stability and low loss characteristics of these two laminates can ensure the reliability of the circuit under complex working environments and long-term operation.
- Wireless communication devices: Wireless communication devices, such as mobile phones and wireless routers, rely on high-frequency signals for data transmission. RO4003C and RO4350B provide high-quality circuit material support for them, improving the communication performance and stability of the devices.
4. Specifications and Manufacturing Related
In terms of standard thickness, RO4003C has various specifications such as 0.002" (0.050mm), 0.003" (0.080mm), and 0.004" (0.100mm); RO4350B has specifications such as 0.005" (0.100mm) and 0.010" (0.254mm), which can meet the material thickness requirements of different circuit designs. The standard panel sizes are 12"×18" (305×457mm) and 24"×18" (610×457mm), and custom sizes can also be provided upon request, providing convenience for manufacturers' production. At the same time, the material can be manufactured using standard epoxy/glass (FR-4) processes, which reduces the difficulty and cost of the production process and facilitates large-scale production.
Rogers RO4003C and RO4350B laminates have become leaders in the field of high-frequency circuit materials with their excellent high-frequency performance, stable physical and electrical characteristics, and wide application adaptability. They provide strong support for the design and manufacturing of high-frequency circuits in the electronics industry and promote the continuous development of high-frequency electronic technology.

PCB
FPC
Rigid-Flex
FR-4
HDI PCB
Rogers High-Frequency Board
PTFE Teflon High-Frequency Board
Aluminum
Copper Core
PCB Assembly
LED light PCBA
Memory PCBA
Power Supply PCBA
New Energey PCBA
Communication PCBA
Industrial Control PCBA
Medical Equipment PCBA
PCBA Testing Service
Certification Application
RoHS Certification Application
REACH Certification Application
CE Certification Application
FCC Certification Application
CQC Certification Application
UL Certification Application
Transformers, Inductors
High Frequency Transformers
Low Frequency Transformers
High Power Transformers
Conversion Transformers
Sealed Transformers
Ring Transformers
Inductors
Wires,Cables Customized
Network Cables
Power Cords
Antenna Cables
Coaxial Cables
Net Position Indicator
Solar AIS net position indicator
Capacitors
Connectors
Diodes
Embedded Processors & Controllers
Digital Signal Processors (DSP/DSC)
Microcontrollers (MCU/MPU/SOC)
Programmable Logic Device(CPLD/FPGA)
Communication Modules/IoT
Resistors
Through Hole Resistors
Resistor Networks, Arrays
Potentiometers,Variable Resistors
Aluminum Case,Porcelain Tube Resistance
Current Sense Resistors,Shunt Resistors
Switches
Transistors
Power Modules
Isolated Power Modules
DC-AC Module(Inverter)
RF and Wireless